Raising 3.485 billion yuan, Guangxun Technology increases investment in optical communications

Recently, Guangxun Technology, a domestic optoelectronic device company, announced that the company's 3.5 billion yuan private placement project has officially been completed. The actual net raised funds was approximately 3.485 billion yuan, setting a record for the company's largest single industry financing in recent years.

Guangxun Technology is the core listing platform of China Information and Communications Technology Group. It is one of the few domestic companies with the ability to vertically integrate the entire chain of optical chips, optical devices, optical modules and subsystems. The company relies on three major chip technology platforms: planar optical waveguides, III-V compound semiconductors and silicon photonics integration. Its products cover core scenarios such as telecommunications transmission, data centers, and computing power networks.

This time, Guangxun Technology’s fixed issuance price is 167.55 yuan per share, with a total of approximately 20.8893 million shares issued. Subscribers include 8 strategic investors including the actual controller China Information Technology Group, leading public funds, well-known private equity and qualified foreign institutional investors.

From the perspective of capital investment, the funds raised this time focus on three major directions: production capacity expansion, technology research and development, and operational support. Among them, 2.083 billion yuan will be used for the production and construction projects of computing power center optical connections and high-speed optical transmission products, focusing on expanding high-end production capacity such as 800G and above high-speed optical modules and coherent products; 617 million yuan will be invested in high-speed optical interconnection and emerging optoelectronic technology research and development projects, focusing on cutting-edge technologies such as silicon optical integration and optoelectronic co-packaging; the remaining approximately 800 million yuan will be used to supplement working capital.

In detail, the construction period of the computing center's optical connection and high-speed optical transmission product production and construction project is four years. The project is located in Wuhan East Lake Comprehensive Bonded Zone. It plans to build a new factory building and supporting facilities of approximately 97,000 square meters and purchase advanced production equipment. After the project is completed, it will have an annual production capacity of 4.992 million high-speed optical modules, 140,000 ultra-wideband amplifiers, 32,000 coherent products, 1.92 million high-density new connectors and 6,400 optical switches. Among them, high-speed optical modules include high-end models such as 1.6T, which are mainly targeted at AI computing power center optical connections and high-speed optical transmission scenarios.

The high-speed optical interconnection and emerging optoelectronic technology research and development projects will focus on three major research and development directions: First, the research and development of high-speed optical devices and optical modules in the computing power center, focusing on 3.2T based on optoelectronic co-packaging technology The development of CPO and NPO optical engines, the development of next-generation pluggable optical modules, and the development of high-port-count all-optical switches; the second is emerging optoelectronics research and development, focusing on the key components and systems of automotive-grade passive optical fiber communications that are pre-installed and mass-produced to support in-car smart driving and smart cockpit businesses; the third is AI plus optoelectronic smart manufacturing, using AI technology to optimize product manufacturing processes and quality control.