With the development of LED market and technology, the cost of various packaging forms has dropped sharply since 2010, and in terms of energy efficiency, it has increased by nearly 40%. Since the space for LED material cost reduction is close to the limit, in the future it is necessary to work hard on the innovation of packaging methods and the promotion of new materials and new technologies. Midstream packaging is the most likely link to reduce costs.
1. Market value and application prospects of chip-scale packaging technology
Chip-scale packaging is also called unpackaged chips in the LED industry. On the surface, chip-scale packaging is a chip that does not need to be packaged. In fact, it is just the chip factory doing the work of the packaging factory. The packaging area is close to the chip area, so it is also called chip size packaging (CSP). CSP is a new advanced packaging situation that has received a lot of development in recent years. Package-free chips are not so much a new technology as they are a big project. Its changes do not only start with packaging, but also with the back-end manufacturing process of the chip. Once popularized, most of the equipment in the packaging factory cannot be used. At the same time, the price of purchasing new equipment is very high, and the process running-in of the packaging factory is also a problem. For companies that are just starting out, it is difficult to achieve the expected pass rate.
1. Market value and application prospects of chip-scale packaging technology
Chip-scale packaging is also called unpackaged chips in the LED industry. On the surface, chip-scale packaging is a chip that does not need to be packaged. In fact, it is just the chip factory doing the work of the packaging factory. The packaging area is close to the chip area, so it is also called chip size packaging (CSP). CSP is a new advanced packaging situation that has received a lot of development in recent years. Package-free chips are not so much a new technology as they are a big project. Its changes do not only start with packaging, but also with the back-end manufacturing process of the chip. Once popularized, most of the equipment in the packaging factory cannot be used. At the same time, the price of purchasing new equipment is very high, and the process running-in of the packaging factory is also a problem. For companies that are just starting out, it is difficult to achieve the expected pass rate.
Chip-scale packaging, the package size does not exceed 1.2 times the chip size. It can eliminate the need for gold wires and brackets, has a compact structure and can reduce costs. The improvement of chip-scale packaging products, light-emitting characteristics and more flexible design flexibility bring more possibilities for LED applications and various designs. For LED companies, the continuous introduction of new technologies and products has become another new direction to resist the price war. However, although chip-scale packaging products have been very popular in the market in 2013, a considerable number of chip-scale packaging products are still in the R&D laboratory. Whether they can enter the mass production stage as soon as possible is still a difficulty that many manufacturers are currently actively overcoming. As more and more competitors enter the chip-scale packaging product market, chip-scale packaging products successfully set off a boom in 2013 and continued until 2014.
In short, package-free chips currently do not have a big cost advantage, and their market share can be said to be zero. But on the other hand, if there is not a large market, there will naturally be no cost reduction brought about by economies of scale. We cannot deny that it is the next technological trend in packaging. If unpackaged chips are promoted on a large scale, the boundaries between packaging factories and chip factories will not be so clear.
2. Development trends and challenges of packaging in the midstream of the LED industry chain
2. Development trends and challenges of packaging in the midstream of the LED industry chain
In April, at the LED New Technology Summit Forum, the industry generally pointed the direction of industrial innovation towards chip-level packaging. Among them, Liu Guoxu, vice president of Yimeixinguang Technology Co., Ltd., said that the biggest link in new technology changes should be packaging. With the rise of chip-scale packaging technology, chip manufacturers may skip packaging manufacturers in the future and supply standard parts to downstream applications. At the same time, he also explained some related technologies about LED packaging
1. Flip chip welding
At present, 80% of LED packaging chips are horizontal structures, 10% are vertical structures, and the remaining 10% are flip chips (sapphire). Flip chip has many advantages, such as no gold wire, high reliability, reduced light absorption, no display electrode to block light, low thermal resistance, etc.
2. Integrated packaging light engine technology
Simple structure, direct AC power drive, no need for AC-DC conversion and electrolytic capacitors, good reliability, eliminating or reducing external PCB structure, saving space; low drive current and better thermal performance; using HV-LED: 6V, 9V, 21V--the drive design is more flexible; dimmable; linear drive, with good power factor and low total harmonic distortion; compared with switch mode design, it has lower electromagnetic interference. At present, dimming to about 10% of the strobe needs to solve the problem of flickering. Gong Wen, general manager of Jingtai Optoelectronics, also strongly agrees with the concept of integration, "Our next research and development direction for COB is to integrate the power supply and control system in a chip-level manner, which can be used as soon as it is connected to power. This method will better save costs, such as IC manufacturing costs. At the same time, this method is more convenient and has higher reliability."
3. Reduce the light efficiency difference between warm white and cool white
Cool white: CCT=4700-7000K, CRI=70-80, warm white: CCT=2500-3700K, CRI=80-90. For warm white, the market share exceeds 60%, and warm white is about 25% lower than cool white LED light efficiency (lm/w). How to narrow the gap between warm white and cool white to about 10%; how to use high-efficiency red LED or new silver light powder material technology to change the absorption and reflectivity of blue light and red-green light on the chip surface are current development challenges.
Cool white: CCT=4700-7000K, CRI=70-80, warm white: CCT=2500-3700K, CRI=80-90. For warm white, the market share exceeds 60%, and warm white is about 25% lower than cool white LED light efficiency (lm/w). How to narrow the gap between warm white and cool white to about 10%; how to use high-efficiency red LED or new silver light powder material technology to change the absorption and reflectivity of blue light and red-green light on the chip surface are current development challenges.
4. High CRI, wide color gamut
For business photos, a high CRI makes colors look vibrant and reds more vivid and lifelike. CRI=95 and R9=95 (saturated red) can be achieved through U or NUV+RGB Phosphor. Other solutions to improve the color rendering index: B+RG Phosphor, BR chip+G Phosphor. For TV and Monitor, the wide color gamut provides a rich color experience. Quantum dots can achieve NTSC 105% and 99% high color gamut. Other solutions to improve the wide color gamut: B+RG Phosphor, BR chip+G Phosphor.
5. Quantum Dot Wavelength Converter
Quantum Dots Characteristics
Nanocrystals made of semiconductor materials can define electron-hole pairs of various sizes and achieve quantum dots with diameters of 3-7nm at different wavelengths (similar to phosphors). All colors of the full spectrum can be achieved, and the peak emission wavelength can be adjusted to +/-1nm by adjusting the size of the crystal particles. The half-peak width is less than 30nm (the half-peak of phosphor is 60-80nm). It can reduce light scattering and has a high quantum efficiency of over 90%.
2. Technology application prospects
“When it comes to new technologies, the biggest change should be packaging.” Liu Guoxu, Yimeixinguang said. The challenge of pushing SSL into the mainstream is not just lm/w. It’s even more lm/$. LED packaging companies should seize opportunities for cost savings and technological innovation. LED packaging type and packaging materials determine whether they can use higher current density and withstand higher ambient temperatures. CSP technology based on inverted chips may become the future technology development direction to reduce costs and improve performance. After a comprehensive analysis of the development trends of midstream LED packaging technology, he emphasized that LED packaging, as the midstream field of the LED industry, will never disappear. In future development, technological innovation is needed to meet market demand.
3. EMC technology and 360-degree luminous COB - high cost performance and low cost
3. EMC technology and 360-degree luminous COB - high cost performance and low cost
Subsequently, Zhang Luhua, project director of Shenzhen Smede, introduced EMC technology and 360-degree luminous COB.
1. EMC technology
The EMC frame has the characteristics of high temperature resistance, anti-yellowing ability, anti-UV ability, and high operating efficiency. Its characteristics bring new options to the pursuit of low-cost LED sealing factories. It solves the high cost problem caused by traditional material packaging's poor heat resistance and failure to meet the heat dissipation requirements of lamps.
In applications, SMD packaging is easy to use in large quantities and can effectively improve production efficiency. Moreover, the high temperature resistance of EMC determines that the heat dissipation requirements for lamps are not very stringent, which can reduce the cost of the radiator to a certain extent and ultimately bring about high cost performance of lamps. EMS technology is widely used in product applications and can be well used in LED lighting, backlighting, etc.
2. 360-degree luminous COB
360° luminous COB is an LED filament similar in appearance to a nostalgic "incandescent lamp". This LED filament has the advantages of vertical heat dissipation and fast heat transfer speed in structure. It is also simple to assemble and small in size, which can effectively reduce glare and ghosting. Currently, many manufacturers are trying to inject this packaging model. But currently, 4W is the main one. If you want to achieve higher wattage, the temperature and reliability must be changed accordingly. · Zhang Luhua, project director of Shenzhen Smede, said that for incandescent lamp manufacturers, the original equipment of the incandescent lamp manufacturer can be used after switching to the production of LED filament lamps. The only thing that needs to be changed is to use the original bracket of the incandescent lamp to design the connection of the LED filament column. The back-end production process also uses the special glass with high light transmission efficiency of the incandescent lamp and the automatic blown glass bulb production technology. This means that for incandescent lamp manufacturers, the emergence of LED filament lamps is undoubtedly a good opportunity. The original production equipment can be fully utilized, and the transformation to LED lighting will not require a "major replacement", which can save companies a lot of money.
In the entire LED industry, LED packaging is an intermediate link. That is, LED packaging factories package various types of purchased LED chips into various devices for sale according to the different needs of downstream customers. With the development of chip-scale packaging technology, this traditional model may be broken.
2013 is the first year of chip-scale packaging in the LED industry, and the chip-scale packaging technology in 2014 has once again brought new opportunities to related companies. The development of new technologies such as chip-scale packaging may also promote the speed of industrial chain integration in the industry. With the rapid development of the LED industry, new technologies, new applications, and new models are driving changes in the entire industry.
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