A list of MLED patent trends from 7 companies including Jucan Optoelectronics and Delong Laser

Recently, Jucan Optoelectronics, Delong Laser, Capgemini Semiconductor, Xianhe New Materials, Ju Energy Electronics, Hengsheng Optoelectronics, and Honghan Optoelectronics have successively announced the latest Mini/Micro LED patent application status, involving improving Mini/Micro LED etching yield, drive circuit repair, optimizing chip luminous intensity and quality, backlight applications, etc.

Jucan Optoelectronics: Apply for a patent for simultaneous etching of Mini/Micro LED with high laser stripping yield

According to information from the State Intellectual Property Office, Jucan Optoelectronics Technology Co., Ltd. has applied for a patent titled "A simultaneous etching method for Mini/Micro LED with high laser stripping yield", with the publication number CN 119698138 A, and the application date is December 2024.

The patent summary shows that the present invention provides a Mini/Micro LED simultaneous etching method with high laser lift-off yield. First, an ISO mask is used to accurately transfer the channel pattern to the chip surface; secondly, the isolation epitaxial layer is partially pre-etched under ICP etching conditions to remove part of the epitaxial layer thickness to ensure that the etching will not touch the chip substrate; then, the SIO DBR layer is deposited, and the SIO is processed under ICP etching conditions. The DBR layer and the isolation epitaxial layer are simultaneously etched again to remove the SIO DBR layer at the bottom of the sapphire substrate while retaining the SIO DBR layer on the sidewalls of the channel. By accurately controlling the ICP power, gas flow, and etching time, the present invention achieves etching uniformity control within ±5 nm, greatly reduces the generation of debris, and improves the laser lift-off yield. In addition, process stability and repeatability are ensured through real-time dynamic feedback control and the use of high-performance ICP equipment.

Delong Laser: Apply for a patent for laser repair equipment to repair Micro LED drive circuits efficiently and accurately

Information from the State Intellectual Property Office shows that Suzhou Delong Laser Co., Ltd. has applied for a patent called "Laser Repair Equipment for Micro LED Drive Circuits", with the public number CN 119634124 A, and the application date is December 2024.

The patent abstract shows that the invention relates to a Micro The laser repair equipment for the LED drive line includes a gantry, a working platform component, a light box component and a spraying component; the gantry is installed on the side of the working platform close to the negative direction of the Y-axis, and the light box component is installed on the top of the gantry along the positive side of the Y-axis. The invention can efficiently and accurately repair short circuits and open circuit defects on the front and back sides of the Micro LED driving circuit and side wires.

Capgemini Semiconductor: Application for patent for high-brightness Micro-LED chip and its production method, chip luminous intensity and quality

According to information from the State Intellectual Property Office, Nanchang Capgemini Semiconductor Technology Co., Ltd. applied for a patent titled "A High-brightness Micro-LED Chip and its Production Method", with the publication number CN 119677250 A, and the application date is December 2024.

The patent abstract shows that the present invention belongs to the field of LED chip technology, and specifically relates to a high-brightness MicroLED chip and a manufacturing method thereof. The high-brightness MicroLED chip includes a second bonding layer, a first bonding layer, a P-type semiconductor layer, a light-emitting layer, an N-type semiconductor layer, a P contact electrode, an N contact electrode, and a passivation layer from bottom to top; the second bonding layer has a pyramidal structure and is regularly distributed on the back of the chip. The present invention can improve the luminous intensity and quality of the MicroLED chip by rationally designing the bonding layer, designing two bonding layers with different materials, and setting the second bonding layer into a regular cone shape. At the same time, the high-temperature quenching process during the production process can improve the density and bonding strength of the first bonding layer and the second bonding layer, and the resulting chip has high brightness and good stability.

Xianhe New Materials obtained the patent for conductive silver glue for Micro-LED pasting and its preparation method and application method

Information from the State Intellectual Property Office shows that Xianhe New Materials Co., Ltd. has obtained a patent titled "Conductive silver glue for Micro-LED pasting and its preparation method and application method", with the authorization announcement number CN 118995105 B, and the application date is October 2024.

The invention discloses conductive silver glue for Micro-LED pasting and its preparation and application methods. The preparation method includes: Step S1: Prepare materials in parts by mass; Step S2: Disperse silver salt, alcohol amine and alcohol ester solvent using planetary dispersion equipment under light-proof conditions. Obtain a uniform liquid silver amine complex solution, and store it in a freezer in the dark for later use; Step S3: Disperse the liquid epoxy resin, acid anhydride curing agent and silver complex solution using a planetary dispersion equipment under sunlight-proof conditions to obtain a conductive silver glue with a viscosity of 1000cps-5000cps. This solution can be applied to EHD nozzles with a diameter of 3 μm. It also ensures that the interface adhesion between the receiving substrate and the Micro-LED chip is greater than the force between the chip and the substrate. After the conductive silver glue is cured, a conductive path is formed to achieve conductive contact between the Micro-LED chip and the metal substrate, so that the Micro-LED chip is 100% lit.

The main products of Xianhe New Materials include thermal interface materials, protective materials, potting adhesive materials, conductive materials and other products, which are widely used in automobiles, communications, consumer electronics, household appliances, industrial control, lighting, semi- Conductors and electronic components and other fields.

Ju Energy Electronics: Application for patent for Mini LED backlight brightness control system applied to display equipment

Information from the State Intellectual Property Office shows that Huizhou Ju Nengeng Electronic Technology Co., Ltd. has applied for a patent titled "A Mini LED backlight brightness control system for display devices", with the publication number CN 119694268 A, and the application date is February 2025.

The patent abstract shows that the present invention relates to the technical field of backlight brightness control, and specifically relates to a Mini LED backlight brightness control system applied to display devices. MPC is used to predict future illumination change trends and optimize the control sequence of backlight adjustment so that it can respond to changes in a short time while reducing violent fluctuations in brightness. In response to ambient light disturbances and sensor errors, sliding mode control is introduced for robust feedback control so that the system can maintain stable brightness output despite external interference. The LED backlight system can not only improve the user's visual comfort, but also optimize energy consumption.

Hengsheng Optoelectronics: Apply for Mini LED dynamic backlight module control patent to improve user viewing experience and comfort

According to information from the State Intellectual Property Office, Shenzhen Hengsheng Optoelectronics Technology Co., Ltd. applied for a patent titled "A Mini LED dynamic backlight module control method and system", with the publication number CN 119673114 A, and the application date is February 2025.

The patent abstract shows that the present invention relates to the field of display technology and discloses a Mini LED dynamic backlight module control method and system. The method includes: analyzing the component status of the Mini LED dynamic backlight control system, constructing an ambient light-backlight brightness model and a user status-backlight brightness model for viewing users; coupling the ambient light-backlight brightness model and the user status-backlight brightness model to obtain a coupled backlight brightness model, and defining the Mini LED dynamic backlight control system corresponding to Mini The initial backlight brightness of the LED;

Receive the display content signal of the Mini LED, extract the display elements of the display content signal and its display element characteristics, analyze the display content of the display content signal and its display content type; use the content adaptive dimming algorithm to analyze the dimming parameters of the Mini LED, send the dimming parameters to the Mini LED drive circuit in the Mini LED dynamic backlight control system, and perform dynamic backlight control of the Mini LED through the Mini LED drive circuit. The invention can improve user comfort in viewing experience .

Honghan Optoelectronics: Obtained a patent for a Mini LED display backlight module

Information from the State Intellectual Property Office shows that Xiamen Honghan Optoelectronics Technology Co., Ltd. has obtained a patent called "A Mini LED display backlight module", with the authorization announcement number CN 222690019 U, and the application date is March 2024.

The patent abstract shows that the utility model discloses a Mini The LED display backlight module specifically relates to the technical field of display screens and includes a fixed plastic frame and a backlight module unit arranged on the side of the fixed plastic frame. Both sides of the backlight module unit are fixedly connected to a limit frame, and a pair of limit blocks are fixedly connected to the limit frame. A cover plate is fixedly connected to the side of the fixed plastic frame, and two pairs of support assemblies are provided on the cover plate. When the utility model is in use, the support assembly provides a backlight module for the fixed plastic frame. The assembly unit uses a supporting surface so that the fixed plastic frame can be placed horizontally on one side of the fixed plastic frame. Then, in order to synchronize the rotation of the first sprocket and the second sprocket on the drive chain, the clamping plate fixed on the second sprocket can be unfolded inward or outward. The clamping plate is designed to flexibly abut against the limit block. This can provide high efficiency for fixing or unfixing the backlight module unit, and the fixation meets the stability, which is more practical.