The modularization trend of MIP technology is obvious. Nationstar Optoelectronics releases MIP panel AS series

In the past year or two, the application potential of MIP packaging technology has been further recognized by the industry chain and the market. Relevant manufacturers continue to drive cost reduction and efficiency improvement of MIP packaging products through innovation, and launch products that are more suitable for downstream manufacturing and better meet market demand.

Exhibits at this year’s ISLE show reflect a significant increase in the number of manufacturers deploying MIP technology and MIP display products. For example, Ledman Optoelectronics, which has been focusing on COB packaging technology, also launched a MIP display for the first time. In terms of technology trends, the trend of modularization of MIP technology is also obvious. This will not only help reduce the cost of MIP systems, but is also a great benefit for downstream display manufacturers to lay out MIP technology routes.

For specific examples of MIP technology modularization, please refer to the products of Nationstar Optoelectronics. The company officially released the MIP panel AS series on April 29. The panel adopts the "MIP + module + GOB" triple technology integration solution. The core advantages mainly include three aspects:

GOB: By changing the existing molded packaging form and simplifying it to GOB packaging, the structure and cost are optimized;

Integration: The AS series MIP panel adopts an integrated process, reducing process links, lowering lamp bead standards, and more structural optimization to achieve better display effects and reliability;

Customization: The lamp beads of the AS series MIP panel can be customized according to needs, and the matching modules can match more varied structures and application scenarios. It has greater advantages in color gamut and differentiation, and is more suitable for the changing market environment in the future.

Nationstar Optoelectronics stated that this series of products is mainly aimed at the micro-pitch display market below P1.2 and can meet the dual needs of image quality accuracy and spatial adaptability in the 4K/8K ultra-high-definition display era.

According to LEDinside, MIP technology is still in the early stages of mass production, and the cost advantage is not obvious in a short period of time. However, as packaging manufacturers continue to explore technological innovation, the cost advantages of MIP technology are gradually emerging from chips, packaging to display screens.

In the chip segment, MIP is a chip-level package that supports the use of continuously shrinking chips. Due to the small size of the chip, the utilization rate of the unit wafer is greatly improved, which means a reduction in the cost of the chip segment.

In the packaging process, the selection of substrates is more flexible, and the accuracy requirements are not high, which can solve the process difficulties between chips and display panels. The yield requirements for mass transfer are also reduced, which is equivalent to reducing production costs.

On this basis, using integrated and GOB packaging, MIP's advantages in image quality, reliability and cost are further highlighted. Taking the GOB (Glue on Board) process as an example, after the lamp beads are bonded to the PCB board, a layer of black optical glue is filled to convert the original point light source into a surface light source. The luminous uniformity and color contrast of the display screen are improved. In addition, product protection and reliability are increased, which is equivalent to reducing back-end maintenance costs and extending product life. The overall cost-effectiveness of MIP panels can be seen from this.

In the display link, in the real Micro LED chip-level MIP packaging process, display manufacturers’ traditional SMT equipment is difficult to be compatible with. However, if packaging manufacturers ship products in the form of MIP panels/modules, this problem will be solved for display manufacturers and the cost of adding new equipment will be saved.

In general, with the development of modularization trend, MIP technology is expected to accelerate its penetration into the downstream market, help LED display manufacturers expand their application boundaries, and thereby increase the market size of LED displays. (Text: LEDinside Janice)

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