The patent abstract shows that the present invention discloses a manufacturing method of an LED device, an LED device and an LED module. The manufacturing method of the LED device includes: laminating the bottom copper foil on a temporary carrier board, and etching the bottom copper foil to form bottom lines and connecting copper pillars; solidifying a driver IC chip on the bottom line, and placing a driver IC chip on the electrode of the driver IC chip. Form an electroplating layer; encapsulate the driver IC chip to form a first package; press the top copper foil on the first package to connect the top copper foil to the electroplating layer; etching the top copper foil to form a top line; solidify and encapsulate the LED chip on the top line to form a second package; peel off the temporary carrier to form an LED device. The invention has a simple manufacturing process, effectively reduces the manufacturing cost of the LED display device, improves the reliability and display effect of the device, and improves the production efficiency of the device.
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