MicroLED-related company Xunlin Technology completed tens of millions of yuan in pre-A round financing

According to 36Kr reports, Tianjin Xunlin Technology Co., Ltd. recently completed a Pre-A round of financing worth tens of millions of yuan. This round of financing was led by Zhongguancun Development Group Qihang Investment, with North Coast Industrial Investment following. This financing will be mainly used for technology research and development, market expansion and industrial chain upgrading and construction.

Xunlin Technology was established in September 2023. It focuses on the surface metallization of ceramic and glass electronic substrates. It is committed to exploring new copper coating technology routes through independently developed PVD technology to solve the technical problems and cost problems of glass substrates and ceramic substrates in the fields of advanced semiconductor processes, high-definition display modules and power devices.

Currently, Xunlin Technology has production lines in Tianjin and Qingdao, has obtained electroplating and etching related licenses, and built a 200,000 square meter continuous batch substrate production line. Its core products such as glass substrates and ceramic substrates have passed the process verification of some customers and have now been put into production and have begun to receive batch orders.

In the field of semiconductor packaging, glass substrates are mainly used in computing chips due to their excellent heat dissipation, thermal conductivity and low dielectric constant. Xunlin Technology is cooperating with leading manufacturers in the industry to promote the development of glass substrate technology, and plans to achieve mass production of glass-based chips with the advancement of packaging technology.

In the fields of backlight display modules and direct display modules, Xunlin Technology has also made progress. It is capable of manufacturing large high-copper thick panels of 1350×1050mm, and has successfully implemented small-pitch high-definition and high-brightness large-size fully transparent glass screen applications. Through fine circuit design, it reduces costs and improves the operability of Mini/Micro LED products.

In the field of PCB replacement substrates, Xunlin Technology is targeting mature markets in communications, consumer electronics, automotive electronics and other fields.