Lipin Semiconductor received 100 million yuan in Series A2 financing to promote the industrialization of full-color MicroLED technology

On April 30, Lipin Semiconductor announced the completion of the A2 round of 100 million yuan financing. The investors in this round are Xienuo Capital and Chongqing Aluminum Investment.

Lekin Semiconductor stated that based on the accumulation of silicon-based GaN epitaxy and chip technology, the company is advancing the mass production process of single-core integrated full-color Micro-LED (LEKIN-SiMiP?) to solve the engineering problems of related display technologies in large-scale manufacturing, and continues to focus on the third-generation semiconductor and new display directions.

Lishen Semiconductor currently focuses on the fields of smart travel, new displays and smart sensing, and its products cover compound semiconductor devices such as optoelectronic chips. The company has formed a technical system covering epitaxy, chips, packaging, modules and applications, and has laid out patents in Europe, the United States, Japan and South Korea.

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In terms of technological progress, in February 2024, the company released the silicon-based GaN single-core integrated full-color Micro LED chip LEKIN-SiMiP, and completed the micro-pitch LED direct display application verification with display companies such as Huike, and conducted technical verification in terms of mass transfer process and yield improvement. At present, this technology has entered the stage of customer verification and mass production introduction.

In November of the same year, Lishen Semiconductor and Xinying Optoelectronics jointly released samples of P0.9 silicon-based Micro LED direct display screens based on this technology, and sent samples to some customers for subsequent application verification. It regards this progress as a stage node in the transformation process of this type of chips from research and development to application.

In terms of product planning, Lipin Semiconductor has proposed a next-generation "light driver integrated" AM-SiMiP chip solution, which aims to integrate silicon-based Micro LED light-emitting structures and silicon-based CMOS drive circuits at the wafer level to improve the achievability of display systems in terms of integration and manufacturing consistency.

In terms of project progress, on December 31, 2025, Lishen Semiconductor's automotive-grade optoelectronic module and silicon-based Micro LED chip manufacturing projects officially started. The total investment of the project is about 5.2 billion yuan, covering an area of about 100 acres, with a planned annual production capacity of 1.56 million sets of automotive disinfection modules and a monthly production capacity of 100,000 display chips.