Zhixinda MicroLED mass transfer side magnetron sputtering film forming machine successfully rolled off the production line

On March 11, Zhixinda’s first large-volume transfer side magnetron sputtering film forming machine successfully rolled off the production line.

It is understood that the massive transfer side magnetron sputtering film forming machine adopts 3D magnetron sputtering technology and low-temperature low-loss technology. By optimizing key technologies such as cathode target application, magnetic field control and plasma area restriction, it significantly improves film formation stability and film adhesion, while reducing high-temperature damage, providing support for the improvement of Micro LED seamless and unlimited splicing performance.

Zhixinda is an enterprise that develops, manufactures and sells core equipment in the semiconductor field. It focuses on new display technologies and has a number of domestic and foreign patents. Its main equipment includes: 3D side wiring vacuum sputtering equipment, semiconductor chip electromagnetic shielding sputtering equipment, Micro OLED low-temperature low-loss sputtering equipment and semiconductor TSV/TGV sputtering equipment.

Since this year, domestic equipment manufacturers have achieved continuous technological innovation and business breakthroughs in the field of Micro LED, providing downstream key equipment including testing, packaging, mass transfer, stripping, repair and epitaxial growth. These developments help improve the yield and efficiency of Micro LED technology and promote the industry to continuously break through technical bottlenecks.

In addition to Zhixinda, equipment manufacturers such as Inno Laser, Onex Technology, and Onex Technology have also made progress in the Micro LED field.

On January 1, Inno Laser announced that it had successfully delivered key Micro LED equipment to new customers, including laser decrystallization and laser cutting equipment. Laser decrystallization is the core process in the "stripping-transfer-decrystallization-crystallization-eutectic" process line. Through laser beam shaping and focusing technology, in conjunction with the platform control system, defective chips, foreign matter and residual glue are accurately and efficiently removed, ensuring that there is no damage to the crystal grains and no dust residue, thereby improving the yield and efficiency of the mass transfer and repair process.

Laser cutting equipment can meet the cutting needs of masks, MIP packages and substrates of various materials. It has the advantages of high precision, high efficiency, small thermal impact, small mechanical stress, and high surface cleanliness.

On January 7, Yibei Technology announced that it had completed the delivery of the last batch of Micro LED mass testing equipment in 2024, successfully achieving the full-year delivery target. The equipment delivered this time includes the M1070P equipment specially designed for COW/COC luminous performance PL testing, and the M1075A equipment for COW/COC appearance/position AOI quantity testing.

In terms of capital markets, the official website of the Shenzhen Stock Exchange shows that Silicon Power Co., Ltd., which focuses on the research and development, production and sales of semiconductor special equipment, submitted an application for GEM IPO registration on January 13. The funds raised this time will be approximately 556 million yuan, and the funds will be used for probe station research and development and industrial base construction, sorting machine technology research and development, marketing service network upgrade and supplement of working capital.

Among them, the sorting machine technology research and development project is mainly oriented towards the application direction of Mini/Micro LED. It plans to introduce advanced R&D software and hardware equipment, establish a fully functional research laboratory, and increase the research and development of high-precision reliability, Mini/Micro LED chip picking and sorting technology.