The patent abstract shows that the present invention discloses a manufacturing method of an LED display module and an LED display module, which belong to the field of display technology. The manufacturing method includes: fixing several LED chips upside down in an array on the transparent adhesive layer of a transparent optical carrier to obtain a chip component; fixing the side of the transparent optical carrier of several chip components on the UV adhesive layer of a flat carrier, and distributing several chip components in an array to obtain Chip component array; after aligning each solder joint of the active substrate with the soldering pins of all the LED chips in the chip component array, the active substrate is welded and fixed on the chip component array to obtain a prototype of the display module; the prototype of the display module is peeled off from the plane carrier to obtain an LED display module. This technical solution can effectively solve the technical problem that the existing LED display manufacturing method uses reflow soldering to achieve direct welding and fixation of the chip and the active substrate and cannot ensure the flatness of the chip.
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