The amount reached up to hundreds of millions of yuan, and two optical communication chip companies completed financing

Recently, two optical communication chip companies, Xilian Optical Core and Xinlu Semiconductor, completed their latest financing.

Xilian Optical Core has completed hundreds of millions of yuan in financing to promote the development of silicon photonic chip technology

According to news on May 18, Changzhou Xilian Optical Core Microelectronics Technology Co., Ltd., a silicon photonic chip company, has completed hundreds of millions of yuan in B5 round financing. Yongxin Ark and a number of industrial capitals, leading RMB funds and US dollar funds participated in this round of investment.

Xilian Optical Core was founded in July 2020 by a number of senior experts in the semiconductor and silicon photonics fields. In October 2021, the company completed the acquisition of Sicoya GmbH, a German silicon photonics technology company, thus forming a parallel innovation structure of two major R&D centers in China and Europe, and establishing a dual-circulation supply chain system for domestic and international markets.

Picture source: Yongxin Ark

Xilian Optical Core can currently provide core products such as silicon photonic chips, analog electronic chips, and optoelectronic co-packaged chips to the global market. Its 1.6T series of silicon photonic products have entered the batch delivery stage and have entered the supply chain system of some global leading customers. The technical route also covers the application needs of next-generation CPO co-packaged optical solutions.

At the OFC 2026 Optical Fiber Communications Conference held earlier this month, Xilian Optical Core showcased a series of 1.6T optical modules based on single-channel 200G silicon optical technology, and conducted interconnection demonstrations with mainstream switching equipment manufacturers in the industry at the exhibition site.

In terms of production capacity, according to public information, the company's second Asian factory in Hangzhou is scheduled to be put into operation in May 2026. The North American manufacturing base in Monterrey, Mexico is expected to be opened in the third quarter of 2026. By then, its global manufacturing capacity is expected to reach hundreds of thousands of pieces per month.

Investor Yongxin Ark said that because silicon photonics solutions are compatible with CMOS integration processes, they have about 10% to 20% advantages over traditional EML solutions in terms of power consumption and cost, and are accelerating penetration in ultra-high-speed optical module markets such as 800G and 1.6T. Relevant industries predict that the future silicon photonic chip market size is expected to reach US$2.4 billion in 2028, and the application boundary will continue to expand from data center optical interconnection to CPO, lidar, optical computing and other scenarios.

The Xilian Optical Core team has accumulated system-level opto-mechanical integration capabilities covering structure, optics, electrical and process design, and has a relatively complete patent layout. The company has achieved mass production and introduction of single-wavelength 200G silicon photonic chips, and has made technical reserves in cutting-edge directions such as single-channel 400G, CPO, NPO and end-of-line chips, and its overall competitiveness is at the forefront of the industry.

Xinlu Semiconductor completed new financing to increase research and development and production of optical communications and other technologies

According to news on May 18, Suzhou Xinlu Semiconductor Co., Ltd. completed a new round of strategic financing. Xinlian Capital and Yida Capital jointly participated in this round of investment. After the financing is completed, Xinlu Semiconductor will accelerate the product development and large-scale mass production of core chips and related high-performance analog chips in the fields of lidar, optical communications and other fields.

Image source: Suzhou Industrial Park Technology Investment Center

As a platform-based high-end analog chip design company, Xinlu Semiconductor settled in Suzhou Industrial Park in 2022. The company has long been responsible for the research and development and strategic planning of lidar, optical communications and automotive-related chip businesses. The company's R&D team has nearly two decades of experience in the field of high-speed and high-performance analog chips.

Currently, Xinlu Semiconductor’s product lines focus on three major directions: automotive lidar core chips, high-speed optical module electronic chips, and industrial and satellite communication radio frequency chips. The company has completed the research and development of laser radar transmitter and receiver core chips, optical module transimpedance amplifier chips and other products, and has achieved introduction and mass production in some industry leading customers. (Source: compiled by TrendForce Optical Communications)

Please indicate the source when reprinting! For more LED information, please pay attention to the official website (www.ledinside.cn) or search the WeChat public account (LEDinside).