Qianzhao, Ruifeng, Xinruida, etc. have obtained LED patents, involving Mini LED, vehicle display, etc.

As the end of the year approaches, the LED-related patents of many companies have entered the latest state of announcement/authorization. Previously, Leyard, Absen, Unilumin Technology, Huati Technology, Colorlight, Silan Micro, Alto Electronics and other companies have released the latest LED patent information.

Recently, Qianzhao Optoelectronics, Ruifeng Optoelectronics, Xinruida, and Mingjiahui have also obtained multiple LED patent authorizations, involving LED epitaxial technology, Mini COB packaging, LED vehicle display, LED physiotherapy applications, etc.

Qianzhao Optoelectronics: 4 LED chip and epitaxy patents have entered the publishing/authorization status

Recently, Qianzhao Optoelectronics has the latest updates on its four LED patents.

Among them, the patent "an LED epitaxial structure" was authorized, the authorization announcement number: CN220121867U, the announcement date was December 1.

The utility model patent provides an LED epitaxial structure. The N-type semiconductor layer includes at least three N-type semiconductor sub-layers, and the N-type doping concentrations of at least two of the N-type semiconductor sub-layers are inconsistent. Further, in the N-type semiconductor layer, the N-type semiconductor sub-layer close to the substrate side is the N-type semiconductor bottom layer, the N-type semiconductor sub-layer close to the active layer side is the N-type semiconductor top layer, and the remaining N-type semiconductor sub-layers are the N-type semiconductor middle layer;

The N-type doping concentration of at least one N-type semiconductor intermediate layer is lower than the N-type doping concentration of the N-type semiconductor bottom layer and/or the N-type semiconductor top layer. The N-type N-type doping concentration of the N-type semiconductor layer is formed into a stepped distribution structure with high and low levels. This structure can buffer high-voltage static electricity, reduce the destructive power of high-voltage static electricity, improve ESD performance, and at the same time avoid affecting the ESD performance due to the reduction of N-type doping of the active layer.

Qianzhao Optoelectronics also announced a patent for "a red MiniLED epitaxial structure, chip and manufacturing method". The patent summary shows that the invention provides a red MiniLED epitaxial structure, a chip and a manufacturing method thereof. The MiniLED epitaxial structure includes a stacked structure. The stacked structure includes a first-type semiconductor layer, a first interface layer, a first waveguide layer, an active region, a second waveguide layer, a second interface layer and a second-type semiconductor layer stacked in sequence. The first interface layer can avoid the dopant diffusion of the first-type semiconductor layer from causing the interface between the first-type confinement layer and the first waveguide layer to become roughened;

The second interface layer prevents dopant diffusion of the second type semiconductor layer This results in a roughening of the interface between the second-type confinement layer and the second waveguide layer; at the same time, it can also avoid the dopant of the first-type semiconductor layer and the second-type semiconductor layer from diffusing into the active area to form a non-radiative recombination center, which leads to the problem of reduced reliability; and the first interface, the first waveguide layer, the second waveguide layer and the second interface layer all include undoped semiconductor material layers, which can effectively improve the crystal quality of the active area, thereby improving the internal quantum efficiency and optical output power.

In addition, Qianzhao Optoelectronics also announced two new Coslight vertical structure LED chips and their manufacturing methods.

Ruifeng Optoelectronics: Three LED-related patents authorized

Recently, Ruifeng Optoelectronics has been authorized for three LED-related patents.

Among them, the patent authorization announcement number of "A Transparent Screen and Vehicle" is: CN220172153U, and the authorization date is December 12.

This utility model patent relates to the technical field of vehicle accessories, especially a transparent screen and a vehicle. The transparent screen includes a glass layer and a film layer. The glass layer includes at least two layers. A cavity is formed between the two glass layers. The film layer is arranged in the cavity and filled with packaging glue in the cavity. The film layer includes a substrate and an LED chip provided on the substrate. Conductive grid lines are arranged in the substrate and are electrically connected to the LED chip;

That is, a film layer is set between the laminated glass layers, and encapsulation glue is poured to complete the packaging of the transparent screen. The structure is simple. The glass layer reduces the impact on the display effect of the film layer, and the combination of the encapsulation glue enhances the structural strength of the transparent screen and improves durability; while the wiring within the substrate uses Conductive grid lines can hide electrical circuit connections, reducing the impact of laying out internal circuits according to general conditions on transparency, and improving the display effect of the transparent screen. The overall setting of the film layer combined with the encapsulation glue makes the transparent screen harder and more durable, reducing the risk of the transparent screen breaking.

"A flash light source structure and light panel": The patent authorization announcement number: CN220172155U, the authorization date is December 12.

This utility model patent relates to the field of LED display technology, and in particular to a flash light source structure and a light panel. The flash light source structure includes a substrate and a plurality of LED chips evenly distributed on the substrate. The side of the LED chip away from the substrate is covered with an encapsulation layer, and the side of the encapsulation layer away from the substrate is covered with a lens;

The end of the lens away from the substrate is defined as the top, and the top bulges away from the LED chip; that is, the substrate, LED chip, packaging layer and lens are arranged in a multi-layer structure in sequence, and the top of the lens bulges like a semicircular design. When the LED chip emits light, a transmission is made through the packaging layer The lens performs secondary transmission to improve the display effect of the flash light source structure, thereby improving the visual effect; and the encapsulation layer can not only bond the LED chip to the substrate, but also increase the stability of the lens cover, and can also protect the LED chip to prevent water vapor from entering and affecting the LED chip's light emission.

"A packaging structure and light panel": Patent authorization announcement number: CN220155560U, authorization date December 8. This utility model patent relates to the field of LED lighting technology, specifically a packaging structure and a light panel. The packaging structure includes a substrate, an LED chip arranged on the substrate, and a lens. The lens is covered on the substrate and encapsulates the LED chip;

There is a relief groove on the side of the lens facing the LED chip. The relief groove is filled with glue, and the LED chip is wrapped in the glue. That is, the lens is designed as a lens with a relief groove to uniformly and expand the light-emitting area, and the light emitted by the LED chip is refracted twice at the interface between the glue and the lens and the interface between the lens and the air. Expanding the light angle allows the entire packaging structure to increase the distance between LEDs under the original OD, thereby reducing the amount of LED chips and glue, reducing costs, and ensuring the display effect of the product; glue can not only increase the stability of lens mounting, but also protect the LED chip to prevent water vapor from entering and affecting the LED chip's light emission.

Recently, Xinruida has obtained 5 utility model patents related to LEDs, namely "an LED backlight with uniform light effect", "a PCB board pad solder paste application device", "a composite lens based on miniCOB packaging", "a LED light board pasting reflective paper device", and "a coating fixture".

Among them, the patent authorization announcement number of "An LED backlight with uniform light effect" is: CN220138314U, and the authorization date is December 5.

This patent discloses an LED backlight source with uniform light effect, including a lead frame. The upper end of the lead frame is fixedly installed with a blue light chip and a green light chip through a die-hardening adhesive. The blue light chip and the green light chip are connected to the lead frame through gold wires, and the blue light chip and the green light chip are connected through gold wires;

The blue light chip and the green light chip are encapsulated with encapsulation glue on the periphery, and an encapsulation lens is provided outside the encapsulation glue, and red phosphor is provided on the encapsulation lens; the encapsulation of the blue light and green light wafer of the present invention can improve the color gamut, without the need for encapsulation glue mixed with phosphor powder, and the lens with phosphor powder can solve the problem of poor light efficiency consistency caused by the heat dissipation of lamp beads, improve the uniformity of the picture, the white light light effect uniformity is better, and will not change with time.

The patent authorization announcement number of "A composite lens based on miniCOB packaging" is: CN220138342U, the authorization date is December 5.

This patent discloses a composite lens based on miniCOB packaging, which relates to the field of LED chip packaging technology and includes a substrate. The substrate is provided with a mounting point for mounting the chip. The chip is fixedly mounted on the mounting point of the substrate through solder paste; the substrate is provided with silica gel, and the silicone gel completely covers the outside of the wafer;

A microlens is provided on the substrate, a wafer hole is provided on the microlens, and a glue hole is provided at the bottom of the wafer hole; the utility model combines UV glue with a mini lens to form a composite lens, which seals and protects the wafer and adjusts the light shape to make the light emitted more uniformly. To change the current situation of single microlens, it can be refractive or reflective, and the consistency can also be well adjusted.

Mingjiahui: Patent for a red light LED therapy sock

Recently, Mingjiahui's invention patent for "a kind of physical therapy socks" was authorized. The authorization announcement number is: CN108835720B, and the authorization date is December 12.

The invention discloses a kind of physical therapy socks, including: a sock body, the sock body is arranged in a sandwich type; a plurality of red LED chips are arranged on the middle interlayer of the sock body, and respectively correspond to a number of acupuncture points on the human foot; a micro power supply is arranged on the middle interlayer of the sock body and is connected to the several red LED chips for controlling the red LED chip to emit red light and acting on the acupuncture points corresponding to the red LED chip.

The present invention sets red LED chips in socks corresponding to various acupuncture points on the human foot, and emits red light through the red LED chip to stimulate the acupoints, massage the acupoints, promote blood circulation, and play a role in physical therapy and health care.