MOCVD leader Veeco acquires SSEC to enter advanced packaging market

On December 4, US precision instrument manufacturer Veeco announced the acquisition of privately held US Solid State Semiconductor Equipment Co., Ltd. (SSEC). Headquartered in Horsham, Pennsylvania, SSEC maintains its leadership in technology by designing and developing wet wafer processing equipment. Target market applications include semiconductor advanced packaging technology (including 2.5D and 3D ICs), microelectromechanical systems, compound semiconductors, front-end and back-end processes, photomasks, and flat panel displays.

"SSEC is a very successful process equipment company and is a great strategic fit for Veeco." said John R. Peeler, Veeco's chairman and chief executive officer. “Both companies’ complementary and differentiated ‘dip and spray’ technologies provide single-chip control at low batch processing costs. SSEC expands our footprint in compound semiconductors and MEMS and serves as a stepping stone for us to enter the advanced packaging market. The The synergistic transaction is effective immediately and we expect it to drive the company's performance growth and profitability. ”

“We are excited to join the Veeco team. Veeco is a dynamic company and a market leader in LED compound semiconductor equipment, power electronics and wireless equipment," said Herman Itzkowitz, CEO of SSEC. "The integration of resources will allow us to accelerate growth and pursue market opportunities in advanced packaging and MEMS. In addition, we have untapped potential in Asia and Europe, where Veeco's impressive sales and service network will provide us with a major source of customers. ”