Currently, many well-known LED companies at home and abroad have begun to invest in the R&D and production process of CSP (Chip Scale Package) level packaging, and many finished light source products have appeared on the market. At the same time, on the product application side, some lighting companies have begun to try the application of CSP light sources in street lamps and other fields. Everyone is optimistic about this advanced packaging form and believes that it will be the future trend.
According to Xiao Guowei, "There are currently three mainstream packaging processes. Among them, the formal LED process is relatively mature and low-cost, but the disadvantage is poor heat dissipation and the risk of wire breakage. Although the vertical LED process can achieve low voltage and good heat dissipation, the process is more complex and the yield rate is low. At the same time, modular applications "Limited use." Xiao Guowei, president of Jinko Electronics (Guangzhou) Co., Ltd., said at the "Tao Industrial Strategy" theme conference sponsored by China Microelectronics on the afternoon of December 12 that the flip-chip LED process has no risk of disconnection, can withstand high currents, is easy to integrate into modules, and can achieve uniform coating of phosphors. Therefore, it becomes the best choice for CSP packaging.
Xiao Guowei believes that the advantage of the flip-chip LED process is that it does not require die-hard adhesive packaging, and can achieve high brightness, high light efficiency, low thermal resistance, and high reliability. At the same time, it has excellent performance in terms of power, heat, light, and electricity, and the yield rate is improving, and the cost of small and medium power is gradually declining.
"The development of flip-chip LED technology in the future will mainly focus on high-power and high-light-density output devices, and the development direction will gradually transition to Flip-chip on PCB (FCOB) and standardized optical components." Xiao Guowei mentioned in a speech titled "LED Technology Development under the Package-Free Storm".
ANNA