Jingneng Optoelectronics provides 8-inch silicon-based MicroLED epitaxial wafers for Hongshi Intelligent

Hongshi Intelligent recently released a new generation of color Micro LED opto-mechanical platform "Yunjin", which further reduces the pixel pitch to 2.4μm based on the previous generation of 3.75μm. The platform uses 8-inch silicon-based Micro LED epitaxial wafers provided by Jingneng Optoelectronics to improve pixel density and full-color display capabilities.

In terms of technical parameters, the platform achieves a pixel density of approximately 10583 PPI, an angular resolution of approximately 32 PPD, an MTF greater than 0.6, and supports VGA (640×480) resolution output. The overall optical-mechanical volume is about 0.16cc, which is suitable for near-eye display application scenarios such as AR.

At the process level, Hongshi Intelligent introduced HB2 (Hybrid Bonding) hybrid bonding technology to connect the drive circuit and the light-emitting array through copper-copper bonding to reduce interconnect resistance and improve heat dissipation performance. Jingneng Optoelectronics' silicon-based epitaxial wafers provide support for this process in terms of material uniformity and interface characteristics.

In terms of optical design, the plan introduces a metasurface structure to regulate the propagation path of light to optimize light extraction efficiency and optical utilization, thereby supporting display output requirements under small-volume conditions.

In addition, the system is equipped with an image quality engine algorithm to optimize color and brightness compensation for pixel-level display to improve display consistency under micro-pixel conditions and reduce power consumption to a certain extent.