On July 17, China Microsystems released its semi-annual performance forecast for 2025. It is expected to achieve operating income of approximately 4.961 billion yuan, a year-on-year increase of approximately 43.88%; net profit attributable to shareholders of the parent company is 680 million to 730 million yuan, a year-on-year increase of 31.61% to 41.28%.
The company's main products include plasma etching equipment, thin film equipment, MOCVD equipment and other high-end semiconductor and pan-semiconductor equipment. In the first half of 2025, etching equipment achieved revenue of 3.781 billion yuan, a year-on-year increase of approximately 40.12%; LPCVD thin film equipment revenue reached 199 million yuan, a year-on-year increase of approximately 608.19%.
During the reporting period, the company's high-end etching products achieved large-scale mass production in key process links in the manufacturing of advanced logic and memory devices, and new shipments increased significantly.
In addition, on March 12, AMEC announced that its global cumulative shipments of plasma etching equipment have exceeded 5,000 units, covering four configurations: CCP high-energy plasma etching machine, ICP low-energy plasma etching machine, single reaction station and dual reaction station reactors.
In terms of research and development, the first half of the company
The annual R&D investment is approximately 1.492 billion yuan, a year-on-year increase of approximately 53.70%, accounting for 30.07% of operating income. The current projects under development cover six major categories of equipment and more than 20 new products. The speed of product research and development has been significantly accelerated, shortened from the previous 3 to 5 years to 2 years or even less. Competitive new products have been accelerated to the market, and the company is expected to launch new products on a large scale in the next few years.
In terms of project construction, on March 26, the company won an industrial land in the core area of Zengcheng Economic and Technological Development Zone. It plans to invest 3 billion yuan in the long term to build the South China headquarters and product R&D and production base, focusing on large flat-panel display equipment, and expanding into emerging micro-processing fields such as smart glass and board-level packaging.
On April 7, the company held a signing event for a micro-processing equipment R&D center in Nanchang. It plans to expand R&D investment in Nanchang High-tech Zone and promote the development of advanced packaging semiconductor manufacturing equipment and processes, third-generation semiconductor power device-related equipment, application promotion of MOCVD equipment for Micro LED, and performance optimization of MOCVD equipment for Mini LED.
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